Why diamond polycrystalline is the heat dissipation material of the future.

Diamond polycrystalline consists of many tiny diamond crystals as a material, which retains the advantages of high thermal conductivity, high strength and good chemical stability of diamond, while overcoming the problems of high cost and difficult processing of single crystal diamond. According to several research reports, the diamond polycrystalline industry will continue to maintain the growth trend in the next few years, and in the future, it will undoubtedly become an important branch of materials science in the future, and bring more innovations and changes to our life and work.

Heat dissipation advantages:

1, high thermal conductivity

The thermal conductivity of diamond polycrystalline is much higher than that of traditional heat dissipation materials, such as copper and aluminium. This gives diamond polycrystalline a significant advantage in the field of heat dissipation. The following is a set of data comparison:

Material thermal conductivity (W/m-K): diamond polycrystalline (1000-2000); copper (385); aluminium (237)

2. good mechanical properties

Diamond polycrystalline has high hardness and wear resistance, suitable for harsh environments in the heat dissipation needs.

3. Chemical stability

Diamond polycrystalline has good chemical stability, not easy to react with other substances, suitable for a variety of environments.

4. Easy to process

Diamond polycrystalline can be processed into different shapes and sizes through cutting, grinding and other processes to meet different heat dissipation needs.

CSMH adopts mpcvd method to prepare large-size, high-quality diamond, and now has mature products: diamond heat sinks, diamond wafers, diamond window sheets, diamond heterogeneous integrated composite substrates, etc., of which diamond heat sinks have thermal conductivity of 1000-2200W/m.k), and wafer-grade diamond surface roughness of Ra<1nm, which are widely used in heat dissipation fields, including high power Semiconductor lasers, optical communications, chip heat dissipation, nuclear fusion, aerospace, etc.