With the continuous improvement of radar system performance, the heat generated by devices also increases, which directly affects the stability and efficiency of the system. Diamond heat sinks, with their unique performance advantages, provide an innovative solution for the thermal management of T/R modules. Through practical application verification, the use of diamond heat sink can significantly improve system performance, prolong equipment life, and open up new possibilities for the design and optimization of radar systems.
Diamond has the advantages of high thermal conductivity and strong adaptability to space environment, and has great potential in solving heat dissipation problems. Researchers used polycrystalline diamond as a heat sink material and embedded 48 high thermal conductivity diamond sheets in the aluminum alloy frame of the antenna T/R module. The remote sensing temperature range of the antenna T/R module can be controlled between 6.2~17.2 ℃, and the maximum temperature gradient of the T/R module is 2.2 ℃; After working in full transmission mode for 20 minutes, the antenna T/R component only heats up by 2.3 ℃. After using diamond heat sink, the working temperature of the components decreases, power consumption decreases, and system efficiency and reliability are significantly improved. In addition, due to the lightweight design of diamond heat sinks, the overall weight of the radar system is reduced, and the airborne residence time is extended.
Advantages of diamond heat sink:
1. Extremely high thermal conductivity: Diamond has a much higher thermal conductivity than traditional materials such as copper and aluminum, which can effectively and quickly dissipate the heat generated by TR components, reducing the operating temperature.
2. Low coefficient of thermal expansion: It matches well with semiconductor materials such as silicon, reduces mechanical stress caused by temperature changes, and improves component life.
3. Lightweight and high-strength: While reducing the overall system weight, it ensures structural stability and adapts to the needs of high-speed mobile platforms.
4. High temperature resistance and chemical stability: Diamond materials can still maintain excellent performance in extreme environments, extending the working time of equipment under harsh conditions.
As a manufacturer of diamond materials, CSMH will continue to be committed to promoting technological innovation and development in this field. CSMH currently has core products such as diamond wafers, diamond heat sinks, diamond windows, and diamond heterojunction integrated composite substrates. Among them, the surface roughness of the diamond wafer Ra<1nm; The thermal conductivity of diamond heat sinks is 1000-2200W/m.k. In addition, diamond heat sinks are applied in many fields such as high-power lasers, aerospace, new energy vehicles, GPUs, etc.
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