Diamond wafer: an essential part of 5G communication field

In the field of 5G communication, the application of diamond wafer is particularly crucial. The high-speed data transmission and large-scale device connectivity of 5G networks pose higher requirements for the performance and stability of communication devices. The efficient heat dissipation ability of diamond wafers can ensure that communication equipment can maintain stable performance output even under continuous high load operation, thereby ensuring the smooth and unobstructed operation of 5G networks.

With the development of 5G technology, electronic devices in aviation, aerospace, communication and other fields are constantly moving towards miniaturization, integration, and high-power. The rapidly increasing heat flux poses a huge challenge to device heat dissipation. Excessive temperature has become one of the important factors that reduce the lifespan and performance failure of electronic devices, and heat dissipation has become an urgent problem to be solved in the industry. CVD diamond, as an excellent thermal management material, plays an important role in high-power, high-frequency, and high-temperature fields due to its superior properties such as high thermal conductivity, high breakdown field strength, high carrier mobility, high temperature resistance, acid and alkali resistance, and corrosion resistance. It can be said that diamond is the preferred and only optional heat sink material in the thermal conductivity requirement range of 1000-2000W/m.k.

In the military industry, diamond heat sinks also play an indispensable role. Military electronic equipment often needs to operate under extreme conditions, such as high temperature, low temperature, high humidity, strong radiation, etc. Diamond heat sink provides strong support for the stable operation of military electronic equipment due to its excellent high-temperature resistance, radiation resistance, and other properties.

CSMH focuses on the production and research and development of diamond materials. Currently, it has mature products such as diamond wafers, diamond heat sinks, diamond optics, diamond heterojunction composite substrates, AlN thin films, etc. Among them, the surface roughness of diamond wafer is Ra<1nMm, and the thermal conductivity of diamond heat sinks is 1000-2200W/(m.K).CSMH has mature cooling solutions and its products have been applied in many fields such as high-power LEDs, lasers, military industry, aerospace, etc.