Cu-diamond composite material: heat dissipation research on fin heat sink

With the continuous development of electronic devices in aerospace, communication and other fields towards miniaturization, integration, and high-power, the rapidly increasing heat flux poses a huge challenge to device heat dissipation. Excessive temperature has become an important factor in reducing the lifespan and performance failure of electronic devices. As the main channel for semiconductor chip heat dissipation, the thermal conductivity of electronic packaging materials determines the efficiency of chip use, thereby affecting the overall performance of electronic components. Therefore, it is urgent to develop effective thermal management methods and efficient thermal management materials to reduce the temperature of electronic products

Fin heat sink is one of the most common and basic heat dissipation devices in electronic products. Connecting electronic packaging modules with fin heat sinks through welding or thermal interface materials can effectively reduce the temperature of electronic packaging modules. Currently, researchers are focusing on optimizing various structural parameters of heat sink fins through theoretical simulation and experimental research, such as quantity, spacing, height, and distribution orientation. However, with the optimization of various parameters and the limitation of processing requirements, the thermal conductivity of heat sink materials has become the main factor limiting the heat dissipation of fin heat sinks

Diamond is the material with the highest thermal conductivity (600~2200 W · m-1 · K-1) in nature and has a lower coefficient of thermal expansion (1.0 × 10-6 K-1 and lower density (3.52 g/cm3). Therefore, diamond as a reinforcing phase can be used to composite with metals such as copper and aluminum to obtain thermal conductivity composite materials with high thermal conductivity and low thermal expansion coefficient. In recent years, the thermal conductivity of metal/diamond composite materials has gradually improved, with copper/diamond composite materials having a thermal conductivity of 930 W/(m· K), which has broad application prospects

Researchers prepared copper boron/diamond composite fin heat sinks with a thermal conductivity of 850 W · m-1 · K-1 and tested their heat dissipation effects in three cooling modes: natural cooling, forced air cooling, and forced water cooling. The results showed that the higher the heat source power, the more significant the heat dissipation effect of the copper boron/diamond composite material. In forced water cooling mode, when the input power of the heating fin is 80 W, the highest temperature of the heating fin when using copper boron/diamond composite fin heat sinks is 14 ℃ lower than when using copper fin heat sinks, and 23 ℃ lower than when using aluminum fin heat sinks. Icepak thermal simulation found that in forced water cooling mode, the highest temperature of the heating fin when using copper boron/diamond composite fin heat sinks is 14 ℃ lower than when using copper fin heat sinks, and 23 ℃ lower than when using aluminum fins heat sinks. When the input power is 80 W in water-cooled mode, compared with copper and aluminum fin heat sinks, the overall temperature of copper boron/diamond composite fin heat sinks is lower and the temperature distribution is more uniform. The research results confirm that copper boron/diamond composite materials are an efficient heat dissipation material and have broad application prospects in high-power electronic device heat dissipation

CSMH focuses on the production and research of diamond semiconductor materials. Its core products include diamond wafers, diamond heat sinks, diamond windows, diamond heterointegrated composite substrates, etc. Among them, the surface roughness of diamond wafer Ra<1nm, and the thermal conductivity of diamond heat sinks is 1000-2000W/(m · K). Currently, its products have been applied in many fields such as aerospace, power electronics, optical communication, new energy photovoltaics, new energy vehicles, sensors, Al, IGBT, high-speed rail, etc.