Sora emerged: Diamond wafers have great potential in GPU cooling

In the wave of artificial intelligence innovation, the launch of Sora by Open AI is undoubtedly an important milestone, and in this revolution, GPU chips play a very important role. With the increasing computing power of electronic devices, the heat dissipation problem of GPU chips will also become more prominent. Applying diamond wafers to chip heat dissipation can further improve the heat dissipation efficiency of chips, ensure the stability and reliability of chips during high load operation.

Sora continues to ignite the wave of AI, which will also lead to a sustained surge in computing power demand in 2024 under the development of multimodal models. Chips and hardware directly determine the performance, efficiency, and energy consumption of AI systems. It is crucial to increase research and development investment in AI chip cooling, improve chip performance, reduce power consumption and costs.

Diamond has excellent thermal conductivity, with a higher thermal conductivity than conventional heat dissipation materials such as copper and aluminum. It has the highest thermal conductivity at room temperature, making it an ideal heat dissipation material for highly integrated electronic devices, high-power laser devices, and microwave devices. Applying diamond wafers to GPU chip heat dissipation can effectively improve the chip's heat dissipation efficiency, enhance chip performance, and reduce power consumption.

This technology is based on diamond as a heat sink material and bonding with silicon. After completing the bonding between silicon and diamond, different functional modules are stacked vertically through micro nano processing technology to form a three-dimensional structure. Finally, electrical interconnection between layers is achieved through interconnection technology. However, this has higher requirements for the smoothness and roughness of diamond surfaces. CSMH has world-class diamond research and production capabilities. Currently, its polycrystalline diamond heat sinks have a thermal conductivity of 1000-2200W/m.k and a surface roughness Ra of less than 1nm, which fully meets the requirements for bonding with semiconductor materials such as silicon and gallium nitride.

With the rapid development of technologies such as 5G and artificial intelligence, the computing power of electronic devices will continue to increase, and the issue of chip heat dissipation will become more prominent. The emergence of diamond heat sinks has brought a new and efficient chip cooling solution to the industry, which has broad application prospects in high-performance computing, 5G communication, artificial intelligence and other fields in the future.

CSMH focuses on the research and development of diamond semiconductor materials, focuses on cutting-edge technology, continues to break through, and leads the direction of technological innovation in diamond heat sinks. Currently, CSMH diamond wafers and diamond heat sinks have been applied in many fields such as 5G communication, high-power lasers, aerospace, radar power components, photovoltaics, and new energy vehicles.