The New Future of "Heat Conduction and Heat Dissipation" ——  Diamond Heat Sink

The tendency of highly integrated integration, miniaturization, wearability, and intelligence of electronic products  can increase in the 5G era. The computing power of 5G chips is at least 5 times higher than that of existing 4G chips and the power consumption is about 2.5 times higher.  While the heat flux increases sharply, thermal management is critical  to the improvement of product stability and energy saving, and the heat dissipation problem needs to be settled urgently. In addition, signal transmission, wireless charging, and product thinness will continue to drive the demand for heat dissipation materials. Traditional heat dissipation materials such as graphite have approached the application limit and materials with higher thermal conductivity have become a new  exploration direction  in the field of heat dissipation materials.

Due to excellent properties such as high thermal conductivity and low coefficient of expansion, diamond has great potential in the field of heat dissipation and it has become the research hotspot of the fourth generation of high thermal conductivity packaging materials. 5G market volume is just around the corner, and the application of diamond heat dissipation may grab the feed from greatest victory in its industry.

Different from traditional packaging materials,  new heat dissipation materials  have a low thermal expansion rate and very light mass. As a representative, diamond is the highest thermal conductivity in nature and  the thermal conductivity of diamond is five times than that of copper. Different kinds of diamond have different thermal conductivity, even the same kind of diamond is not necessarily have the same thermal conductivity. The thermal conductivity of diamond is related to the internal structure integrity,  the type and content of impurities contained, and the temperature.

High thermal conductivity is associated with high electrical conductivity. Unlike metals that rely on peripheral electrons for heat transfer, diamond's thermal conductivity basically comes from phonons.

When the composition of the substance is simpler, the structure is simpler, and the impurities are less, the phonon movement is faster, and the heat transfer rate is faster. Diamond is composed of only a single element carbon and the structure is also very simple. Among  Ia, Ib, IIa and IIb,  IIa is the purest. So it has the highest heat transfer rate.

Besides, diamond also has the characteristics of high resistivity and high breakdown field strength, low dielectric constant, low thermal expansion, etc., which has obvious advantages in the heat dissipation problem of high-power optoelectronic devices. It  also shows that diamond has great application potential in the field of heat dissipation.

As a high-tech enterprise focusing on the research and development, production and sales of the third generation semiconductor substrate materials, CSMH  has  fundamentally solves the heat dissipation problem. CSMH's core products, such as diamond heat sink ,  diamond wafer, diamond window, have been applied to RF communication, lasers, military, power devices and other fields.