Diamond is the best thermal conductor on earth. Combined with a low dielectric constant, it is an excellent RF dielectric material for high-frequency applications in which thermal performance is equally critical. By applying cutting-edge thin film process and extensive millimeter wave design experience, high-performance line of resistive components, diamond Rf resistors, terminations, and attenuators, are significantly reduced in size and unparalleled in average and peak power handling.
Diamond is known as the material with the highest room-temperature thermal conductivity of any material. Recently, CVD diamond outperforms today’s common materials for thermal management, such as copper, silicon carbide, and aluminum nitride, by factors of 3 to 10 times. With excellent properties such as low weight, electrical insulation, mechanical strength, low toxicity and low dielectric constant, CVD diamond wafer is the optimal heat spreader for device and package designers.
Leveraging synthetic diamond’s unparalleled thermal properties will help to easily deal with the "heat dissipation" problems faced by today's electronic power and power devices, and achieve improved reliability and increased power density on a smaller footprint. Once the "thermal" problem is solved, by effectively improving the performance of thermal management, CVD diamond will also enable dramatic increases in lifetime and power of semiconductor devices, and at the same time, significantly reduce operating costs.
Diamond Heat Sink TC1200、TC 1500、TC 1800
Internationally leading technology to achieve high surface finish Ra < 1 nm
CSMH develops an efficient and precise machining method to reduce the surface roughness of 2-inch diamond substrates from tens of microns to less than 1nm, based on plasma-assisted polishing. This technique has a high removal efficiency, which can obtain atomically flat surfaces without leaving a rough surface with significant sub-surface damage. At present, CSMH has reached the international leading level to achieve high surface finish Ra < 1 nm.
High Thermal Conductivity：1000-2000 W/m. K
To meet the thermal conductivity requirements of 1000~2000W/m. k, diamond heat sink is the first choice and the only optional heat sink material. CSMH can customize the thermal conductivity according to customer requirements. Currently, three standard products have been launched: TC1200, TC 1500, TC 1800.
Customized Services on Thickness, Size and Shape
CSMH can customize the CVD diamond with thicknesses from 200 to 1000 microns and in diameters up to 125 mm. CSMH’s laser cutting and polishing capabilities provide our customers the geometry, surface flatness, low roughness and metallization service that meet their specific requirements.
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