Diamond has a wide bandgap, high thermal conductivity, high breakdown field strength, high carrier mobility, high temperature resistance, acid and alkali resistance, corrosion resistance, and radiation resistance. Its superior performance makes it play an important role in high-power, high-frequency, and high-temperature fields. It has emerged in fields such as optical communication, chip cooling, new energy vehicles, 5G base stations, military aerospace, and high-power electronic devices.
Optical communication: The emergence of large-area and high thermal conductivity CVD diamond films has made it possible for their thermal management applications in high-power laser diode arrays (LDAs) and other microelectronic and optoelectronic devices. The highest thermal conductivity level of diamond has reached 2200w/m.k.
Chip heat dissipation: Another more attractive application prospect of diamond heat sink is in the developing multi chip assembly technology, which aims to tightly arrange many ultra large scale integrated circuit chips in a three-dimensional manner to form ultra small and ultra-high performance devices. The heat dissipation of these chips is the key to this technology, and diamond film is the most ideal material to solve this technical problem.
New energy vehicles: Diamond is a direct competitor of SiC. Unlike the upper limit of 200 ° C (392 ° F) for SiC, diamond can operate above 500 ° C. Many similar challenges faced in military aviation applications, such as high temperatures, also apply to the automotive industry, where it is necessary to reduce the overall heat loss of engines.
5G base station: Currently, the average power consumption of a single tenant of a 5G outdoor base station is around 3.8KW, which is more than three times that of a 4G base station. The cost of electricity may overdraw all the profits of the operator. The 5G market is about to expand, and diamond, as a thermal management material for 5G base stations, will greatly save electricity by fully leveraging its excellent heat dissipation performance, truly achieving green, environmental protection, and low-carbon.
Military aerospace: GaN is accelerating the exploration of applications in the aerospace field, and the combination of GaN and diamond will achieve a significant leap in performance. CSMH is the first domestic enterprise in China to conduct research in this direction and has made multiple breakthroughs.
High power electronic devices: Diamond heat sinks can effectively solve heat dissipation problems and improve the performance of power devices at the same size. The size of diamond heat sinks is no longer limited to individual devices or small arrays, and the array size can be extended to a few centimeters. Widely used in various devices. When used in phased array chips, it can significantly improve the reliability of the system and reduce the size and cost of the system; When used in solid-state power amplifiers, it can significantly reduce the size, cost, and quality of the device, and improve efficiency; When used for broadband communication, reliability can be improved while reducing chip size costs.
CSMH focuses on the research and development, production, and sales of diamond wide bandgap materials. Its diamond wafer Ra<1nm, diamond heat sink thermal conductivity 1000-2000W/m.k, core products include diamond wafers, diamond heat sinks, diamond windows, diamond hetero-integrated composite substrates, AlN films, etc., and CSMH is committed to solving the thermal management problems of high-power devices in various industries. It has been recognized by professional customers in fields such as optical communication, chip cooling, new energy vehicles, 5G base stations, military aerospace, and high-power electronic devices.
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