Diamond materials enhance the heat dissipation effect of aging test equipment

Each step of chip aging testing is very important. Once a problem occurs at a certain stage, leading to chip failure, it will directly result in a significant waste of manpower, material resources, and financial resources. If the heat dissipation technology is not well done, it will directly affect the performance of the device, lead to a decrease in lifespan and reliability, and even damage the chip. Diamond has high thermal conductivity characteristics and will play an important role in the heat dissipation field of aging equipment.

In the test, the product side increases the current step by step. As the current continues to increase, the thermal power consumption of the product also increases. Logically, the temperature is constantly increasing. The test aims to ensure that the temperature of the product at each intermediate current point is a constant value (usually 25 ℃).

In practice, this will result in waiting long enough for each step to achieve thermal equilibrium if the heat dissipation effect is not good, resulting in very poor efficiency and long testing time. Diamond has excellent properties such as wide bandgap, high thermal conductivity, high breakdown field strength, high carrier mobility, high temperature resistance, acid and alkali resistance, corrosion resistance, and radiation resistance. It is currently one of the most promising semiconductor materials, and its classic application scenario is in the field of thermal management. By utilizing the high thermal conductivity of diamond, the temperature thermal equilibrium time during the testing process can be shortened, and the efficiency of aging testing can be improved.

In addition, in order to better ensure temperature stability: on the one hand, it is necessary to improve the thermal conductivity of the fixture base and its contact with the chip, so that the temperature of the heating table can be quickly transmitted to the chip; On the other hand, reducing opportunities for contact with the external environment and avoiding heat exchange with the external environment.

CSMH focuses on the production and research of diamond materials, mastering internationally leading diamond production processes, and possessing mature product systems and thermal management solutions. Among them, the surface roughness of diamond wafers is Ra<1nm, and the thermal conductivity of diamond heat sinks reaches 1000-2000W/(M.K). It can provide customized services, including diamond wafers, diamond heat sinks, diamond windows, and diamond heterojunction integrated composite substrates.