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AlN on Diamond

CSMH firstly innovated the technology of diamond-based AlN with XRD (0002) rocking curve<3°, ultra-high thermal conductivity of diamond (thermal conductivity at room temperature can reach 2000W/m.K), Ra <2nm, contributing to a brand new application of AlN.

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Rocking Curve

XRD(0002)<3°

Diamond Ultra-high Thermal Conductivity

Thermal Conductivity up to 2000W/m.K

Growth Surface Roughness

Ra<2nm(200nm)

World's First Product

for high quality GaN Epitaxial Growth


CSMH firstly innovated the technology of diamond-based AlN with XRD (0002) rocking curve<3°, ultra-high thermal conductivity of diamond (thermal conductivity at room temperature can reach 2000W/m.K), Ra <2nm, contributing to a brand new application of AlN.

Aluminum nitride (AlN) is an ultra-wide bandgap semiconductor material with many excellent properties, such as the 6.2eV band gap, high breakdown field strength, high saturation electron mobility, high chemical and thermal stability. Therefore, AlN is particularly useful as a substrate material for the deep ultraviolet (DUV) LEDs, and other high-power, high-frequency electronic devices. Nowadays, AlN is the preferred piezoelectric material for GHz-level surface acoustic wave (SAW) devices due to its excellent thermal stability, chemical resistance, and low propagation losses.


Advantages of AlN

• Wide bandgap of 6.2eV, it is an important material for the DUV LEDs (UVC band, 200 – 300 nm)

• Material properties that are ideal for high-temperature, high-frequency, and high-power devices: 1) high breakdown electric field, 2) high thermal conductivity, 3) high electric insulation, 4) low dielectric constant, 5) low coefficient of thermal expansion, 6) good mechanical properties, 7) and corrosion resistance.

• Best materials for the sensors, actuators and filters with very good piezoelectric properties (especially along the C-axis)

• A preferred substrate material for heteroepitaxial growth of gallium nitride (GaN)-based optoelectronic devices due to its very close lattice constant and thermal expansion coefficient to GaN crystal 


Excellent physical properties of AlN

•Atoms are bound by covalent bonds, with good chemical stability and high melting point;

•It is a piezoelectric and dielectric material with high mechanical strength and electrical insulation.

•The crystal film has high hardness and can be used as wear-resistant coating;

•High resistivity, low leakage current and high breakdown field strength make it one of the best choices for insulating buried layer materials in microelectronic devices;

•The fabrication process is compatible with CMOS, and can be integrated with other devices on the same chip;

• It is a wide and direct band gap optoelectronic material capable of emitting blue and ultraviolet light with high efficiency;

•It has outstanding piezoelectricity and high-speed propagation performance of surface acoustic wave along the c-axis, and its the sound transmission speed is the highest of all inorganic nonferrous piezoelectric materials.


AIN on Diamond-003


Substrate: 200μm~500μm; PVD

Inch:1cm*1cm; 2 inch;Customized

AlN Thickness:5~200nm, customized

Orientation:c-aixs [0001]

Ra(nm)(5x5um):Ra < 2nm (200nm)

XRD (°)  FWHM @ (0002):<3°

Warp:<30μm

Bow:-10 ~15μm

Packing: Single/Multi Wafer Cassette

application area

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