CSMH graphene thermal pad is a new type of ultra-thin thermal pad with ultra-low thermal resistance. The thermal pad mainly uses two-dimensional materials as thermal conductive fillers. It uses advanced preparation technology to arrange the two-dimensional materials in an orderly manner in the polymer matrix to form a good thermal conduction path, which greatly improves the thermal conduction efficiency. It is especially suitable for high heat flux density equipment such as base stations and chips. In addition, the ultra-thin thermal pad has the characteristics of high resilience, low density and not easy to deform, and can be used as a substitute for thermal grease.
FEATURES:
· Low density
· Low thermal resistance
· High rebound
· Good thermal stability
APPLICATIONS:
· Base station
· Chip
· Large server
· Data processing center
This series of products are environmentally compliant with RoHS 2.0, halogen, and REACHstandards.
STORAGE CONDITIONS: Storage in the darkness
STORAGE TEMPERATURE: ≤ 25°C
STORAGE HUMIDITY: ≤ 70%
SHELF LIFE:
Under storage conditions: 1 year
Non storage conditions: 6 months.
application area
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